參數(shù)資料
型號： PC7410MGSU500N
廠商： Atmel Corp.
英文描述： PowerPC 7410 RISC Microprocessor Product Specification
中文描述： 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格
文件頁數(shù)： 15/54頁
文件大?。?/td> 692K
代理商： PC7410MGSU500N
15
PC7410
2141D–HIREL–02/04
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as
follows:
where:
T
j
= die-junction temperature
T
a
= inlet cabinet ambient temperature
T
r
= air temperature rise within the computer cabinet
θ
jc
= junction-to-case thermal resistance
θ
int
= adhesive or interface material thermal resistance
θ
sa
= heat sink base-to-ambient thermal resistance
P
d
= power dissipated by the device
During operation, the die-junction temperatures (T
j
) should be maintained less than the
value specified in Table 4. The temperature of the air cooling the component greatly
depends upon the ambient inlet air temperature and the air temperature rise within the
electronic cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30
°
C
to 40
°
C. The air temperature rise within a cabinet (T
r
) may be in the range of 5
°
C to
10
°
C. The thermal resistance of the thermal interface material (
θ
int
) is typically about
1
°
C/W. Assuming a T
a
of 30
°
C, a T
r
of 5
°
C, a CBGA package
θ
jc
= 0.03, and a power
consumption (P
d
) of 5.0 watts, the following expression for T
j
is obtained:
30
°
C
5
°
C
0,03
°
C W
1,0
°
C W
+
(
+
+
=
For a Thermally heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa
) ver-
sus airflow velocity is shown in Figure 7.
T
j
T
a
T
r
θ
jc
θ
int
θ
sa
+
+
(
)
P
d
×
+
+
=
T
j
θ
sa
+
)
5
W
×
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