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參數(shù)資料
| 型號(hào)： | P80C562 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT MICROCONTROLLER |
| 中文描述： | 8位微控制器 |
| 文件頁數(shù)： | 50/52頁 |
| 文件大?。?/td> | 299K |
| 代理商： | P80C562 |
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1997 Apr 08
50
Philips Semiconductors
Product specification
8-bit microcontroller
P83C562; P80C562
23 SOLDERING
23.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
23.2
Reflow soldering
Reflow soldering techniques are suitable for all PLCC
packages.
The choice of heating method may be influenced by larger
PLCC packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
23.3
Wave soldering
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
23.4
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
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| P82284 | Clock Driver and Ready Interface for iAPX 286 Processors PRELMINARY |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P80C562EBA | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller |
| P80C562EBA/02 | 制造商:NXP Semiconductors 功能描述:IC 8BIT CPU SMD 80C562 PLCC68 |
| P80C562EBA/02,512 | 功能描述:8位微控制器 -MCU 80C51 8BIT A/D 16MHZ ROMLESS RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P80C562EBA/02 | 制造商:NXP Semiconductors 功能描述:IC 8BIT CPU SMD 80C562 PLCC68 |
| P80C562EFA | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller |
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