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參數(shù)資料
| 型號(hào)： | OPA621KP |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 193K |
| 代理商： | OPA621KP |
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OPA621
4
OPA621
Basic Model Number
Performance Grade Code
K = –40
°
C to +85
°
C
Package Code
P = 8-pin Plastic DIP
U = 8-pin Plastic SO-8
PIN CONFIGURATION
1
2
3
4
8
7
6
5
No Internal Connection
Positive Supply (+V )
Output
No Internal Connection
No Internal Connection
Inverting Input
Non-Inverting Input
Negative Supply (–V )
ORDERING INFORMATION
Top View
DIP/SO-8
ABSOLUTE MAXIMUM RATINGS
NOTE: (1) Packages must be derated based on specified
θ
JA
. Maximum T
J
must
be observed.
Supply .............................................................................................
±
7VDC
Internal Power Dissipation
(1)
.......................... See Applications Information
Differential Input Voltage............................................................. Total V
Input Voltage Range .................................... See Applications Information
Storage Temperature Range KP, KU: ............................ –40
°
C to +125
°
C
Lead Temperature (soldering, 10s)............................................... +300
°
C
(soldering, SO-8 3s) ........................................ +260
°
C
Output Short Circuit to Ground (+25
°
C) .................. Continuous to Ground
Junction Temperature (T
J
) ............................................................ +175
°
C
PACKAGE DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
OPA621KP
OPA621KU
8-Pin Plastic DIP
8-Pin SO-8
006
182
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
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