參數(shù)資料
型號(hào): OPA2357AIDGSR
英文描述: 250MHz, Rail-to-Rail I/O, CMOS Operational Amplifier with Shutdown
中文描述: 250MHz的,軌至軌I / O,CMOS運(yùn)算放大器具有關(guān)斷
文件頁(yè)數(shù): 18/23頁(yè)
文件大?。?/td> 424K
代理商: OPA2357AIDGSR
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SBOS235C MARCH 2002 REVISED MAY 2004
www.ti.com
18
5. Connect all holes, including those within the thermal pad
area and outside the pad area, to the internal ground plane
or other internal copper plane for single-supply
applications, and to V for split-supply applications.
6. When laying out these holes, do not use the typical web
or spoke via connection methodology, as shown in
Figure 12. Web connections have a high thermal
resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes soldering
the vias that have ground plane connections easier.
However, in this application, low thermal resistance is
desired for the most efficient heat transfer. Therefore, the
holes under the PowerPAD package should make their
connection to the internal ground plane with a complete
connection around the entire circumference of the
plated-through hole.
Web or Spoke Via
NOT RECOMMENDED
(due to poor heat conduction)
Solid Via
RECOMMENDED
Figure 12. Internal ESD Protection
7. The top-side solder mask should leave the pad
connections and the thermal pad area exposed. The
thermal pad area should leave the 13 mil holes exposed.
The larger holes outside the thermal pad area may be
covered with solder mask.
8. Apply solder paste to the exposed thermal pad area and
all of the package terminals.
9. With these preparatory steps in place, the PowerPAD IC
is simply placed in position and run through the solder
reflow operation as any standard surface-mount
component. This results in a part that is properly installed.
For detailed information on the PowerPAD package
including thermal modeling considerations and repair
procedures, please see Technical Brief SLMA002,
PowerPAD Thermally Enhanced Package
, located at
www.ti.com.
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OPA2357AIDGST 功能描述:高速運(yùn)算放大器 250MHz Rail-to-Rail I/O CMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
OPA2357AIDGST 制造商:Texas Instruments 功能描述:IC OP AMP DUAL CMOS SMD MSOP10
OPA2357AIDGSTG4 功能描述:高速運(yùn)算放大器 250MHz Rail-to-Rail I/O CMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
OPA2363 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.8V, 7MHz, 90dB CMRR, SINGLE-SUPPLY, RAIL-TO-RAIL I/O OPERATIONAL AMPLIFIER