參數(shù)資料
型號(hào)： OL2300NHN
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 通信及網(wǎng)絡(luò)
英文描述： Fractional-N PLL based transmitter
中文描述： SPECIALTY TELECOM CIRCUIT, PQCC16
封裝： 3 X 3 MM, 0.85 MM HEIGHT, LEAD FREE, PLASTIC, MO-220, SOT758-1, VQFN-16
文件頁(yè)數(shù)： 40/46頁(yè)
文件大?。?/td> 951K
代理商： OL2300NHN
OL2300
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 28 October 2010
40 of 46
NXP Semiconductors
OL2300
Fractional-N PLL based transmitter
11. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
11.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
11.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
11.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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OL2300NHN/F,118 功能描述:鎖相環(huán) - PLL Fractional-N PLL Based Transmitter RoHS:否 制造商:Silicon Labs 類(lèi)型:PLL Clock Multiplier 電路數(shù)量:1 最大輸入頻率:710 MHz 最小輸入頻率:0.002 MHz 輸出頻率范圍:0.002 MHz to 808 MHz 電源電壓-最大:3.63 V 電源電壓-最小:1.71 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:QFN-36 封裝:Tray
OL2311AHN/C0B,515 功能描述:射頻接收器 Single-chip sub 1GHz RF receiver RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:GPS Receiver 封裝 / 箱體:QFN-24 工作頻率:4.092 MHz 工作電源電壓:3.3 V 封裝:Reel
OL2381AHN/C0B,515 功能描述:射頻收發(fā)器 Single Chip 1-GHz 射頻收發(fā)器 RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類(lèi)型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類(lèi)型:SPI 封裝 / 箱體:QFN-32 封裝:Tray
OL2381AHN/C0B515 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
OL2385AHN/00100Y 功能描述:RF WIRELESS PLATFORM UHF 制造商:nxp usa inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 類(lèi)型:TxRx + MCU 射頻系列/標(biāo)準(zhǔn):- 協(xié)議:- 調(diào)制:ASK，F(xiàn)SK 數(shù)據(jù)速率（最大值）:- 功率 - 輸出:14dBm 靈敏度:-124dBm 存儲(chǔ)容量:- 串行接口:SPI，UART GPIO:12 電壓 - 電源:1.9 V ~ 5.5 V 電流 - 接收:- 電流 - 傳輸:29mA 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤(pán) 標(biāo)準(zhǔn)包裝:1
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