參數(shù)資料
型號: NTE861
廠商: NTE Electronics, Inc.
英文描述: Integrated Circuit Quad, Normally Open, SPST JFET Analog Switch w/Disable
中文描述: 集成電路四,聚苯乙烯場效應(yīng)模擬開關(guān),常開/禁用
文件頁數(shù): 1/3頁
文件大?。?/td> 26K
代理商: NTE861
NTE861
Integrated Circuit
Quad, Normally Open, SPST JFET
Analog Switch
w
/Disable
Description:
The NTE861 is a monolithic combination of bipolar and JFET technology producing a one chip quad
JFET switch. A unique circuit technique is employed to maintain a constant resistance over the ana-
log voltage range of
±
10V. The input is designed to operate from minimum TTL levels, and switch
operation also ensures a break–before–make action.
Features:
Analog signals are not loaded
Constant “ON” resistance for signals up to
±
10V and 100kHz
Pin compatible with CMOS switches with the advantage of blow out free handling
Small signal analog signals to 50MHz
Break–before–make action
High open switch isolation at 1.0MHz
Low leakage in “OFF” state
TTL, DTL, RTL compatibility
Single disable pin opens all switches in package
This device operates from a
±
15V supply and swings a
±
10V analog signal. The JFET switches are
designed for applications where a dc to medium frequency analog signal needs to be controlled.
Absolute Maximum Ratings:
Positive Supply–Negative Supply (V
CC
–V
EE
)
Reference Voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Input Voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Current
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Dissipation (Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Thermal Resistance, Junction–to–Ambient, R
thJA
Lead Temperature (Soldering, 10 seconds)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Note 1 For operating at high temperature this device must be derated based on a +100
°
C maximum
junction temperature and a thermal resistance of +150
°
C/W.
36V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
EE
V
R
V
CC
V
R
–4.0V
V
IN
V
R
+6.0V
V
EE
V
A
V
CC
+6V; V
A
V
EE
+36V
I
A
<
20mA
500mW
0
°
to 70
°
C
–65
°
to 150
°
C
85
°
C/W
+300
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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