
-3-
Nichia STSE-CC4017B
<Cat.No.040512>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Standard
Test Method
JEITA ED-4701
300 301
Test Conditions
Note
2 times
Number of
Damaged
0/50
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min.
5min.
30min.
5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
20 cycles
0/50
0/50
Temperature Cycle
Moisture Resistance Cyclic
100 cycles
0/50
10 cycles
0/50
High Temperature Storage
1000 hrs.
0/50
Temperature Humidity
Storage
Low Temperature Storage
Ta=60°C, RH=90%
1000 hrs.
0/50
Ta=-40°C
1000 hrs.
0/50
Steady State Operating Life
Condition 1
Steady State Operating Life
Condition 2
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Ta=25°C, I
F
=20mA
1000 hrs.
0/50
Ta=25°C, I
F
=30mA
500 hrs.
0/50
Ta=85°C, I
F
=5mA
1000 hrs.
0/50
60°C, RH=90%, I
F
=15mA
500 hrs.
0/50
Ta=-30°C, I
F
=20mA
1000 hrs.
0/50
JEITA ED-4701
400 403
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3direction, 4cycles
3mm, 5 ± 1 sec.
48min.
0/50
Substrate Bending
Stick
JEITA ED-4702
1 time
0/50
JEITA ED-4702
5N, 10 ± 1 sec.
1 time
0/50
(2) CRITERIA FOR JUDGING THE DAMAGE
Item
Criteria for Judgement
Min.
-
-
L.S.L.**)
$
0.7
Symbol
Test Conditions
Max.
Forward Voltage
Reverse Current
Luminous Intensity
*) U.S.L.
:
Upper Standard Level **) L.S.L.
:
Lower Standard Level
V
F
I
R
I
V
I
F
=20mA
V
R
=5V
I
F
=20mA
U.S.L.*)
$
1.1
U.S.L.*)
$
2.0
-