參數(shù)資料
型號(hào): NLX3G17BMX1TCG
廠商: ON Semiconductor
文件頁數(shù): 2/11頁
文件大小: 0K
描述: IC BUFFER TRPL SCHMT TRG 8ULLGA
標(biāo)準(zhǔn)包裝: 3,000
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相
元件數(shù): 3
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-XFLGA
供應(yīng)商設(shè)備封裝: 8-ULLGA(1.6x1)
包裝: 帶卷 (TR)
NLX3G17
http://onsemi.com
10
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10
B
0.05
A
C
L
7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.15
0.25
D
1.60 BSC
E
1.00 BSC
e
0.40 BSC
L
0.25
0.35
L1
0.30
0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.26
7X
0.49
8X
1.24
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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