參數(shù)資料
型號: NLX3G17BMX1TCG
廠商: ON Semiconductor
文件頁數(shù): 11/11頁
文件大小: 0K
描述: IC BUFFER TRPL SCHMT TRG 8ULLGA
標(biāo)準(zhǔn)包裝: 3,000
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相
元件數(shù): 3
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-XFLGA
供應(yīng)商設(shè)備封裝: 8-ULLGA(1.6x1)
包裝: 帶卷 (TR)
NLX3G17
http://onsemi.com
9
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10
B
0.05
A
C
L
7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.15
0.25
D
1.45 BSC
E
1.00 BSC
e
0.35 BSC
L
0.25
0.35
L1
0.30
0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.22
7X
0.48
8X
1.18
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.35
1
MOUNTING FOOTPRINT
PKG
OUTLINE
相關(guān)PDF資料
PDF描述
OSTH409705B CONN PLUG HEADER 9PS 5MM
OSTH409705A CONN PLUG HEADER 9PS 5MM
OSTHW115050 TERMINAL BLOCK PLUG 5.08MM 11POS
OSTTS11015B CONN TERM BLK PLUG 11POS 7.62MM
SQM48T25033-NBC0 DC/DC EIGHTH BRICK
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NLX3G17CMX1TCG 功能描述:緩沖器和線路驅(qū)動(dòng)器 TRIPLE BUFFER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
NLXP610PE.B1 制造商:Rochester Electronics LLC 功能描述:- Bulk
NLXT300ZPE.F4 制造商:Intel 功能描述:Framer E1/T1 5V 28-Pin PLCC 制造商:Rochester Electronics LLC 功能描述:- Bulk
NLXT300ZPE.F4 S E001 制造商:Intel 功能描述:Framer E1/T1 5V 28-Pin PLCC T/R
NLXT301ZPE.F4 制造商:Rochester Electronics LLC 功能描述:- Bulk