參數(shù)資料
型號: NLAS324
廠商: ON SEMICONDUCTOR
英文描述: Dual SPST Analog Switch, Low Voltage, Single Supply
中文描述: 雙路SPST模擬開關(guān),低電壓,單電源
文件頁數(shù): 2/12頁
文件大?。?/td> 111K
代理商: NLAS324
NLAS324
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage
0.5 to
7.0
V
V
I
DC Input Voltage
0.5 to
7.0
V
V
O
DC Output Voltage
0.5 to
7.0
V
I
IK
DC Input Diode Current
V
I
< GND
50
mA
I
OK
DC Output Diode Current
V
O
< GND
50
mA
I
O
DC Output Sink Current
50
mA
I
CC
DC Supply Current per Supply Pin
100
mA
I
GND
DC Ground Current per Ground Pin
100
mA
T
STG
Storage Temperature Range
65 to
150
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
260
C
T
J
Junction Temperature under Bias
150
C
JA
Thermal Resistance
(Note 1)
250
C/W
P
D
Power Dissipation in Still Air at 85 C
250
mW
MSL
Moisture Sensitivity
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V-0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 150
N/A
V
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute maximum-rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow.
2. Tested to EIA/JESD22-A114-A.
3. Tested to EIA/JESD22-A115-A.
4. Tested to JESD22-C101-A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V
CC
Positive DC Supply Voltage
2.0
5.5
V
V
IN
Digital Input Voltage (Enable)
GND
5.5
V
V
IO
Static or Dynamic Voltage Across an Off Switch
GND
V
CC
V
V
IS
Analog Input Voltage (NO, COM)
GND
V
CC
V
T
A
Operating Temperature Range, All Package Types
-55
+125
°
C
t
r
, t
f
Input Rise or Fall Time,
(Enable Input)
V
cc
= 3.3 V + 0.3 V
V
cc
= 5.0 V + 0.5 V
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
N
1
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 2. Failure Rate vs. Time Junction Temperature
TIME, YEARS
T
J
T
J
T
J
T
J
T
J
T
J
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