NE5230, SA5230, SE5230
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Single Supply Voltage
VCC
18
V
Dual Supply Voltage
VS
±9
V
VIN
±9 (18)
V
Differential Input Voltage (Note
1)±VS
V
CommonMode Voltage (Positive)
VCM
VCC + 0.5
V
CommonMode Voltage (Negative)
VCM
VEE 0.5
V
Power Dissipation (Note
2)PD
500
mW
Thermal Resistance, JunctiontoAmbient
N Package
D Package
RqJA
130
182
°C/W
Operating Junction Temperature (Note
2)TJ
150
°C
Operating Temperature Range
NE
SA
SE
TA
0 to 70
40 to 85
40 to 125
°C
80 Output ShortCircuit Duration to Either Power Supply Pin (Notes
2 and
3)Indefinite
s
Storage Temperature
Tstg
65 to 150
°C
Lead Soldering Temperature (10 sec max)
Tsld
230
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Can exceed the supply voltages when VS ≤±7.5 V (15 V).
2. The maximum operating junction temperature is 150°C. At elevated temperatures, devices must be derated according to the package thermal
resistance and device mounting conditions.
Derate above 25°C at the following rates:
N package at 7.7 mW/°C
D package at 5.5 mW/°C.
3. Momentary shorts to either supply are permitted in accordance to transient thermal impedance limitations determined by the package and
device mounting conditions.
RECOMMENDED OPERATING CONDITIONS
Characteristic
Value
Unit
Single Supply Voltage
1.8 to 15
V
Dual Supply Voltage
±0.9 to ±7.5
V
CommonMode Voltage (Positive)
VCC + 0.25
V
CommonMode Voltage (Negative)
VEE 0.25
V
Temperature
NE Grade
SA Grade
SE Grade
0 to +70
40 to +85
40 to +125
°C