參數(shù)資料
型號(hào): NDS9410
廠商: Fairchild Semiconductor Corporation
英文描述: Single N-Channel Enhancement Mode Field Effect Transistor
中文描述: 單個(gè)N -溝道增強(qiáng)型場(chǎng)效應(yīng)晶體管
文件頁(yè)數(shù): 2/8頁(yè)
文件大?。?/td> 230K
代理商: NDS9410
NDS9410A Rev B(W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Test Conditions
Symbol
Parameter
Min
Typ
Max
Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
BV
DSS
T
J
Coefficient
I
DSS
Zero Gate Voltage Drain Current
I
GSSF
Gate–Body Leakage, Forward
I
GSSR
Gate–Body Leakage, Reverse
V
GS
= 0 V, I
D
= 250
μ
A
30
V
Breakdown Voltage Temperature
I
D
= 250
μ
A, Referenced to 25
°
C
28
mV/
°
C
V
DS
= 24 V, V
GS
= 0 V
V
GS
= 20 V, V
DS
= 0 V
V
GS
= –20 V V
DS
= 0 V
2
μ
A
nA
nA
100
–100
On Characteristics
V
GS(th)
Gate Threshold Voltage
V
GS(th)
T
J
Temperature Coefficient
R
DS(on)
Static Drain–Source
On–Resistance
(Note 2)
V
DS
= V
GS
, I
D
= 250
μ
A
I
D
= 250
μ
A, Referenced to 25
°
C
1
1.6
3
V
Gate Threshold Voltage
-4.3
mV/
°
C
V
GS
= 10 V, I
D
= 7.3 A
V
GS
= 10 V, I
D
= 7.3 A, T
J
=125
°
C
V
GS
= 4.5 V, I
D
= 6.3 A
V
GS
= 4.5 V, I
D
= 6.3 A, T
J
=125
°
C
V
GS
= 10 V, V
DS
= 5 V
19
30
25
42
28
45
42
75
m
I
D(on)
On–State Drain Current
20
A
g
FS
Forward Transconductance
V
DS
= 15 V,
I
D
= 7.3 A
22
S
Dynamic Characteristics
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
830
185
80
pF
pF
pF
V
DS
= 15 V, V
GS
= 0 V,
f = 1.0 MHz
Switching Characteristics
t
d(on)
Turn–On Delay Time
t
r
Turn–On Rise Time
t
d(off)
Turn–Off Delay Time
t
f
Turn–Off Fall Time
Q
g
Total Gate Charge
Q
gs
Gate–Source Charge
Q
gd
Gate–Drain Charge
(Note 2)
6
10
18
5
14
2.7
3.0
12
20
32
10
22
ns
ns
ns
ns
nC
nC
nC
V
DD
= 25 V, I
D
= 1 A,
V
GS
= 10 V, R
GEN
= 6
V
DS
= 15 V, I
D
= 2 A,
V
GS
= 10 V
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
2.2
A
V
SD
V
GS
= 0 V,
I
S
= 2.2 A
(Note 2)
0.78
1.1
V
Notes:
1.
R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θ
JC
is guaranteed by design while R
θ
CA
is determined by the user's board design.
a) 50°/W when
mounted on a 1in
2
pad of 2 oz copper
b) 105°/W when
mounted on a .04 in
2
pad of 2 oz copper
c) 125°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300
μ
s, Duty Cycle < 2.0%
N
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