參數(shù)資料
型號： NCP5318FTR2G
廠商： ON SEMICONDUCTOR
元件分類： 穩(wěn)壓器
英文描述： Two/Three/Four−Phase Buck CPU Controller
中文描述： SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQFP32
封裝： LEAD FREE, LQFP-32
文件頁數(shù)： 1/31頁
文件大小： 384K
代理商： NCP5318FTR2G
Semiconductor Components Industries, LLC, 2006
June, 2006
Rev. 4
1
Publication Order Number
NCP5318/D
NCP5318
Two/Three/FourPhase
Buck CPU Controller
The NCP5318 provides full
featured and flexible control
conforming to the Intel
VRM 10.1 specification for
high
performance CPUs. The IC can be programmed as a two
,
three
or four
phase buck controller, and the per
phase switching
frequency can be as high as 1.0 MHz. Combined with external gate
drivers and power components, the controller implements a compact,
highly integrated multi
phase buck converter.
Enhanced V
2
control inherently compensates for variations in
both line and load, and achieves current sharing between phases. This
control scheme provides fast transient response, reducing the need for
large banks of output capacitors and higher switching frequency.
Features
Switching Regulator Controller
Programmable 2/3/4 Phase Operation
Lossless Current Sensing
Enhanced V
2
Control Method Provides Fast Transient Response
Programmable Up to 1.0 MHz Switching Frequency Per Phase
Programmable Adaptive Voltage Positioning
Programmable Soft
Start Time
Current Sharing
Differential Current Sense Pins for Each Phase
Current Sharing Within 10% Between Phases
Protection Features
Programmable Latching Overcurrent Protection
“111110” and “111111” DAC Code Fault
Latched Overvoltage Protection
Undervoltage Lockout
External Enable Control
Three
State MOSFET Driver Control through DRVON Signal
System Power Management
6
Bit DAC with 0.5% Tolerance Compatible with VRM 10.1
Specification
Programmable Lower Power Good Threshold
Power Good Output with Delay
Pre
set No Load Offset Voltage
Pb
Free Package is Available*
*For additional information on our Pb
Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb
Free Package
MARKING
DIAGRAM
I
LIM
R
OSC
V
CC
GATE1
GATE2
GATE3
GATE4
GND
V
ID2
V
ID3
V
ID4
PWRLS
V
FFB
SS
PWRGD
DRVON
V
I
V
I
V
I
E
C
C
C
C
S
V
D
V
F
C
C
C
C
C
PIN CONNECTIONS
(Top View)
Device
Package
Shipping
ORDERING INFORMATION
LQFP
32
FT SUFFIX
CASE 873A
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2000 Tape & Reel
NCP5318FTR2
LQFP
32
2000 Tape & Reel
NCP5318FTR2G
LQFP
32
(Pb
Free)
NCP5318
AWLYYWWG
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