NCP2809 Series
http://onsemi.com
23
PACKAGE DIMENSIONS
Micro10
CASE 846B03
ISSUE D
S
B
M
0.08 (0.003)
A S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
2.90
3.10
0.114
0.122
B
2.90
3.10
0.114
0.122
C
0.95
1.10
0.037
0.043
D
0.20
0.30
0.008
0.012
G
0.50 BSC
0.020 BSC
H
0.05
0.15
0.002
0.006
J
0.10
0.21
0.004
0.008
K
4.75
5.05
0.187
0.199
L
0.40
0.70
0.016
0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B01 OBSOLETE. NEW STANDARD
846B02
B
A
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
T SEATING
PLANE
C
H
J
L
SCALE 8:1
10X
8X
1.04
0.041
0.32
0.0126
5.28
0.208
4.24
0.167
3.20
0.126
0.50
0.0196
mm
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*