
NB6L16
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3
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Un-
its
VCC
PECL Mode Power Supply
VEE = 0 V
3.6
V
VEE
NECL Mode Power Supply
VCC = 0 V
3.6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
3.6
V
Iout
Output Current
Continuous
Surge
25
50
mA
VINPP
Differential Input Voltage
|D D| VCC VEE w 2.8 V
VCC VEE t 2.8 V
2.8
|VCC VEE|
V
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
SOIC8
190
130
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
SOIC8
41 to 44
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
TSSOP8
185
140
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
TSSOP8
41 to 44
°C/W
Tsol
Wave Solder
Standard
PbFree
v 3 sec @ 248°C
v 3 sec @ 260°C
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.