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參數(shù)資料
| 型號(hào)： | NB3RL02FCT2G |
| 廠商： | ON Semiconductor |
| 文件頁(yè)數(shù)： | 8/8頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC CLK BUFFER 1:2 52MHZ 8-WLCSP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | 扇出緩沖器（分配） |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 1:2 |
| 差分 - 輸入:輸出： | 無(wú)/無(wú) |
| 輸入： | 時(shí)鐘 |
| 輸出： | LVCMOS |
| 頻率 - 最大： | 52MHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFBGA，WLCSP |
| 供應(yīng)商設(shè)備封裝： | 8-WLCSP（1.57x.77） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | NB3RL02FCT2GOSDKR |
NB3RL02
http://onsemi.com
8
PACKAGE DIMENSIONS
WLCSP8, 1.57x0.77
CASE 499BQ01
ISSUE O
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN
MAX
MILLIMETERS
A1
D
0.77 BSC
E
b
0.21
0.25
e
0.40 BSC
0.50
D
E
A B
PIN A1
REFERENCE
e
A
0.05
B
C
0.03 C
0.05 C
8X
b
12
D
C
B
0.10 C
A1
C
0.13
0.17
1.57 BSC
PITCH
0.23
8X
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
RECOMMENDED
PACKAGE
OUTLINE
e
PITCH
A
8X
A
e/2
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NB3RL02/D
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