參數(shù)資料
型號: NB3N551DG
廠商: ON Semiconductor
文件頁數(shù): 7/7頁
文件大?。?/td> 0K
描述: IC CLK BUFFER 1:4 180MHZ 8-SOIC
標(biāo)準(zhǔn)包裝: 98
類型: 扇出緩沖器(分配)
電路數(shù): 1
比率 - 輸入:輸出: 1:4
差分 - 輸入:輸出: 無/無
輸入: LVCMOS,LVTTL
輸出: LVCMOS,LVTTL
頻率 - 最大: 180MHz
電源電壓: 3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 管件
產(chǎn)品目錄頁面: 1115 (CN2011-ZH PDF)
其它名稱: NB3N551DG-ND
NB3N551DGOS
NB3N551
http://onsemi.com
7
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA01
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C
0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C
0.10
C
0.10
C
0.08
NOTE 4
A1
SEATING
PLANE
e/2
e
8X
K
NOTE 3
b
8X
0.10
C
0.05
C
A B
B
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.20
0.30
D
2.00 BSC
D2
1.10
1.30
E
2.00 BSC
E2
0.70
0.90
e
0.50 BSC
K
L
0.25
0.35
1
4
8
5
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
8X
DIMENSIONS: MILLIMETERS
0.30
PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
L1
0.10
0.30 REF
0.90
1.30
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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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NB3N551/D
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