參數(shù)資料
型號: MX887DHTTR
廠商: IXYS Integrated Circuits Division
文件頁數(shù): 6/6頁
文件大?。?/td> 610K
描述: MICROPOWER HALL-EFFECT SWITCH
標(biāo)準(zhǔn)包裝: 3,000
傳感范圍: ±60G 跳閘,±6G 釋放
類型: 全極開關(guān)
電源電壓: 2.5 V ~ 5.5 V
電流 - 電源: 2mA
電流 - 輸出(最大): 5mA
輸出類型: 數(shù)字式,開漏極
工作溫度: -40°C ~ 85°C
封裝/外殼: TO-236-3,SC-59,SOT-23-3
供應(yīng)商設(shè)備封裝: TSOT-23-3
包裝: 帶卷 (TR)
INTEGRATED CIRCUITS DIVISION
MX887D
6
www.ixysic.com
R01
3.5 Mechanical Dimensions
3.5.1  MX887DHT TSOT23 3-Lead Package
3.5.2  MX887DHTTR Tape & Reel Packaging
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
Recommended PCB Land Pattern
2.60 / 3.00
(0.102 / 0.118)
0.10 / 0.25
(0.004 / 0.010)
0.37 / 0.47
(0.015 / 0.019)
2.80 / 3.00
(0.110 / 0.118)
0.75 / 0.90
.030 / 0.035)
0.95 BSC
(0.037 BSC)
1.50 / 1.70
(0.059 / 0.067)
0.35 / 0.51
(0.014 / 0.020)
0.00 / 0.10
(0.000 / 0.004)
0.70 / 0.80
(0.028 / 0.031)
1.90 BSC
(0.0748 BSC)
0.60 REF
(0.0236 REF)
0.25 BSC
(0.0098 BSC)
0.10 MIN
(0.004 MIN)
5?NOM
7?NOM
0?/ 8?/DIV>
1
2
3
1.05
(0.041)
2.70
(0.106)
0.95
(0.037)
0.60
(0.024)
otes: (Unless otherwise specified)
. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm
 (0.004 inches) per side.
. Dimension E does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.
. Package top may be smaller than package bottom. Dimensions D and E1 are determined at the outermost extreme of the plastic body
E
E1
D
N TE:T
im n i n  n    h wn   m l  wi h  EDE
n  r  EIA-4 1-2
Em
m n
mbossed Carrier
Top Cover
Tape Thickness
0.066 MAX.
(0.003 MAX.)
178 DIA.
(7.01 DIA.)
Dimensions
mm
(inches)
K
0
=1.1 ?0.1
(0.043 ?0.004)
P=4.0 ?0.1
(0.157 ?0.004)
A
O
=3.2 ?0.1
(0.126 ?0.004)
B
O
=3.2 ?0.1
(0.126 ?0.004)
W=8.0 ?0.2
(0.315 ?0.008)
P=4.0 ?0.1
(0.157 ?0.004)
2.0 ?0.05
(0.079 ?0.002)
1.75 ?0.1
(0.069 ?0.004)
?.5, +0.1, -0
(?.059, +0.004, -0)
3.5 ?0.05
(0.138 ?0.002)
?.1 ?0.1
(0.043 ?0.004)
0.25 ?0.05
(0.001 ?0.002)
Specification: DS-MX887D-R01
〤opyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
or additional information please visit www.ixysic.com
XYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
eserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
r implied. Except as set forth in IXYS Integrated Circuits Divisions Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
hatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
articular purpose, or infringement of any intellectual property right.
he products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
he body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Divisions product may result in direct physical
arm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
o its products at any time without notice.
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