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參數(shù)資料
| 型號(hào)： | MTV16N50E |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類(lèi)： | JFETs |
| 英文描述： | 16 A, 500 V, 0.4 ohm, N-CHANNEL, Si, POWER, MOSFET |
| 封裝： | D3PAK-3 |
| 文件頁(yè)數(shù)： | 1/10頁(yè) |
| 文件大?。?/td> | 276K |
| 代理商： | MTV16N50E |
1
Motorola TMOS Power MOSFET Transistor Device Data
Advance Information
TMOS E-FET.
Power Field Effect Transistor
D3PAK for Surface Mount
N–Channel Enhancement–Mode Silicon Gate
This high voltage MOSFET uses an advanced termination
scheme to provide enhanced voltage–blocking capability without
degrading performance over time. In addition, this advanced TMOS
E–FET is designed to withstand high energy in the avalanche and
commutation modes. The new energy efficient design also offers a
drain–to–source diode with a fast recovery time. Designed for high
speed switching applications in power supplies, converters, PWM
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas
are critical and offer additional safety margin against unexpected
voltage transients.
Robust High Voltage Termination
Avalanche Energy Specified
Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
IDSS and VDS(on) Specified at Elevated Temperature
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain–to–Source Voltage
VDSS
500
Vdc
Drain–to–Gate Voltage (RGS = 1.0 M)
VDGR
500
Vdc
Gate–to–Source Voltage — Continuous
VGS
±20
Vdc
Drain Current — Continuous
Drain Current — Continuous @ 100
°C
Drain Current — Single Pulse (tp ≤ 10 s)
ID
IDM
16
9.0
60
Adc
Apk
Total Power Dissipation
Derate above 25
°C
Total Power Dissipation @ TA = 25°C (1)
PD
180
1.4
2.0
Watts
W/
°C
Watts
Operating and Storage Temperature Range
TJ, Tstg
– 55 to 150
°C
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10 Vdc, Peak IL = 16 Apk, L = 6.7 mH, RG = 25 )
EAS
860
mJ
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
Thermal Resistance — Junction to Ambient (1)
R
θJC
R
θJA
R
θJA
0.7
62.5
35
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8
″ from case for 10 seconds
TL
260
°C
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E–FET is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Order this document
by MTV16N50E/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
CASE 433–01, Style 2
D3PAK Surface Mount
MTV16N50E
TMOS POWER FET
16 AMPERES
500 VOLTS
RDS(on) = 0.40 OHM
D
S
G
N–Channel
Motorola, Inc. 1996
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MTV1-6PAL79 | 制造商:ITT Interconnect Solutions 功能描述:Conn Unshrouded Header PIN 6 POS 1.27mm Solder RA Thru-Hole |
| MTV1-6PH003 | 制造商:ITT Interconnect Solutions 功能描述:Cable Assembly Pre-Wired Pigtail 0.457m 26AWG 6 POS Micro Strip PIN Crimp |
| MTV1-6PH025-1 | 制造商:ITT Interconnect Solutions 功能描述:MTV1-6PH025-1 / 097420-0059 / Micro |
| MTV1-6PH027-1 | 制造商:ITT Interconnect Solutions 功能描述:Conn Wire to Wire PIN 6 POS Crimp ST Cable Mount |
| MTV1-6PH6-01 | 制造商:ITT Interconnect Solutions 功能描述:MTV1-6PH6-01 - Bulk |
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