參數資料
型號: MTP3055VG
廠商: ON SEMICONDUCTOR
元件分類: JFETs
英文描述: 12 A, 60 V, 0.15 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
封裝: GREEN, CASE 221A-09, 3 PIN
文件頁數: 5/7頁
文件大?。?/td> 202K
代理商: MTP3055VG
MTP3055V
http://onsemi.com
5
VDS
,DRAINT
OSOURCE
VOL
TAGE
(VOL
TS)
V GS
,GA
TET
OSOURCE
VOL
TAGE
(VOL
TS)
DRAINTOSOURCE DIODE CHARACTERISTICS
0.50
0.60
0.70
0.80
1.0
VSD, SOURCETODRAIN VOLTAGE (VOLTS)
Figure 8. GateToSource and DrainToSource
Voltage versus Total Charge
I S
,SOURCE
CURRENT
(AMPS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
RG, GATE RESISTANCE (OHMS)
1
10
100
t,TIME
(ns)
VDD = 30 V
ID = 12 A
VGS = 10 V
TJ = 25°C
tf
td(off)
VGS = 0 V
TJ = 25°C
Figure 10. Stored Charge
0
QT, TOTAL CHARGE (nC)
24
6
8
13
ID = 12 A
TJ = 25°C
VGS
0
6
8
10
12
1000
100
10
1
10
6
2
0
12
8
4
60
50
40
30
20
10
0
VDS
1
357
9
4
0.55
0.65
0.75
0.85 0.90
2
0.95
QT
Q1
Q2
Q3
11
10
12
td(on)
tr
04
12
IS, SOURCE CURRENT (AMPS)
Q
RR
,ST
ORED
CHARGE
(
C)
dIS/dt = 100 A/μs
VDD = 25 V
TJ = 25°C
0.08
0.10
0.11
0.12
0.13
0.09
26
8
10
Figure 11. Diode Forward Voltage versus Current
μ
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous draintosource voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (TC) of 25°C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed
in
AN569,
“Transient
Thermal
ResistanceGeneral Data and Its Use.”
Switching between the offstate and the onstate may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (VDSS) is exceeded and the
transition time (tr,tf) do not exceed 10 μs. In addition the total
power averaged over a complete switching cycle must not
exceed (TJ(MAX) TC)/(RθJC).
A Power MOSFET designated EFET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases nonlinearly with an
increase of peak current in avalanche and peak junction
temperature.
Although many EFETs can withstand the stress of
draintosource avalanche at currents up to rated pulsed
current (IDM), the energy rating is specified at rated
continuous current (ID), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 13). Maximum
energy at currents below rated continuous ID can safely be
assumed to equal the values indicated.
相關PDF資料
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