
Semiconductor Components Industries, LLC, 2006
August, 2006 Rev. 5
1
Publication Order Number:
MTD6P10E/D
MTD6P10E
Preferred Device
Power MOSFET
6 Amps, 100 Volts
PChannel DPAK
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. The energy efficient design also
offers a draintosource diode with a fast recovery time. Designed for
low voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Features
Avalanche Energy Specified
SourcetoDrain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
IDSS and VDS(on) Specified at Elevated Temperature
PbFree Packages are Available
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
100
Vdc
DraintoGate Voltage (RGS = 1.0 MW)
VDGR
100
Vdc
GatetoSource Voltage
Continuous
Nonrepetitive (tp ≤ 10 ms)
VGS
VGSM
± 15
± 20
Vdc
Vpk
Drain Current
Continuous
Continuous @ 100°C
Single Pulse (tp ≤ 10 ms)
ID
IDM
6.0
3.9
18
Adc
Apk
Total Power Dissipation
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 2) PD
50
0.4
1.75
W
W/°C
W
Operating and Storage Temperature Range
TJ, Tstg
55 to
150
°C
Single Pulse DraintoSource Avalanche
Energy Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
IL = 6.0 Apk, L = 10 mH, RG = 25 W)
EAS
180
mJ
Thermal Resistance
JunctiontoCase
JunctiontoAmbient (Note
1) JunctiontoAmbient (Note
2)RqJC
RqJA
2.50
100
71.4
°C/W
Maximum Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
2. When surface mounted to an FR4 board using the 0.5 sq.in. drain pad size.
D
S
G
Device
Package
Shipping
ORDERING INFORMATION
MTD6P10E
DPAK
75 Units/Rail
PChannel
MTD6P10ET4
DPAK
2500 Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
http://onsemi.com
100 V
660 mW
RDS(on) TYP
6.0 A
ID MAX
V(BR)DSS
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MTD6P10ET4G
DPAK
(PbFree)
2500 Tape & Reel
MTD6P10EG
DPAK
(PbFree)
75 Units/Rail
MARKING DIAGRAM & PIN ASSIGNMENTS
Y
= Year
WW
= Work Week
T6P10E
= Device Code
G
= PbFree Package
Gate 1
4
Drain
DPAK
CASE 369C
STYLE 2
1 2
3
4
YWW
P10EG
Drain 2
Source 3
T6