參數(shù)資料
型號(hào): MTD2955E
廠商: ON SEMICONDUCTOR
元件分類: JFETs
英文描述: 12 A, 60 V, 0.3 ohm, P-CHANNEL, Si, POWER, MOSFET
封裝: DPAK-3
文件頁數(shù): 3/10頁
文件大?。?/td> 210K
代理商: MTD2955E
MTD2955E
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250 Adc)
Temperature Coefficient (Positive)
V(BR)DSS
60
85
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
10
100
Adc
Gate–Body Leakage Current (VGS = ±15 Vdc, VDS = 0)
IGSS
100
nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)
Temperature Coefficient (Negative)
VGS(th)
2.0
3.0
4.0
Vdc
mV/
°C
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 6.0 Adc)
RDS(on)
0.26
0.30
Ohm
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 12 Adc)
(ID = 6.0 Adc, TJ = 125°C)
VDS(on)
4.3
3.8
Vdc
Forward Transconductance (VDS = 13 Vdc, ID = 6.0 Adc)
gFS
3.0
4.8
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Ciss
565
700
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
225
315
Reverse Transfer Capacitance
f = 1.0 MHz)
Crss
45
100
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
(VDD = 30 Vdc, ID = 12 Adc,
VGS = 10 Vdc,
RG = 9.1 )
td(on)
9.0
20
ns
Rise Time
(VDD = 30 Vdc, ID = 12 Adc,
VGS = 10 Vdc,
RG = 9.1 )
tr
39
80
Turn–Off Delay Time
VGS = 10 Vdc,
RG = 9.1 )
td(off)
17
35
Fall Time
RG = 9.1 )
tf
8.0
20
Gate Charge
(See Figure 8)
(VDS = 48 Vdc, ID = 12 Adc,
VGS = 10 Vdc)
QT
16
32
nC
(See Figure 8)
(VDS = 48 Vdc, ID = 12 Adc,
VGS = 10 Vdc)
Q1
3.0
(VDS = 48 Vdc, ID = 12 Adc,
VGS = 10 Vdc)
Q2
6.0
Q3
5.0
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 12 Adc, VGS = 0 Vdc)
(IS = 12 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
2.2
1.8
3.8
Vdc
Reverse Recovery Time
(See Figure 14)
(IS = 12 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s)
trr
100
ns
(See Figure 14)
(IS = 12 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s)
ta
75
(IS = 12 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s)
tb
25
Reverse Recovery Stored Charge
QRR
0.475
C
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the drain lead 0.25
″ from package to center of die)
LD
4.5
nH
Internal Source Inductance
(Measured from the source lead 0.25
″ from package to source bond pad)
LS
7.5
nH
(1) Pulse Test: Pulse Width
≤ 300 s, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
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