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參數(shù)資料
| 型號： | MT28C128532W18EFW-F605-P706BTWT |
| 元件分類： | 存儲器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA77 |
| 封裝： | FBGA-77 |
| 文件頁數(shù)： | 6/15頁 |
| 文件大?。?/td> | 158K |
| 代理商： | MT28C128532W18EFW-F605-P706BTWT |
128Mb MULTIBANK BURST FLASH
32Mb/64Mb BURST CellularRAM COMBO
PRELIMINARY
09005aef80b10a55
Micron Technology, Inc., reserves the right to change products or specifications without notice..
MT28C128564W18E_B.fm - Rev. B, Pub 11/03 EN
14
2003 Micron Technology, Inc
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
All other trademarks are the property of their respective owners.
Figure 5: 77-Ball FBGA
NOTE:
1. All dimensions in millimeters.
Data Sheet Designation
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full charac-
terization of production devices.
For additional documentation concerning Flash and CellularRAM features, functional descriptions, program-
ming, and timing, please refer to the table below.
BALL A1 ID
1.025 ±0.075
SEATING PLANE
0.10 C
C
1.40 MAX
BALL A8
BALL A1 ID
0.80
TYP
0.80 TYP
2.80 ±0.05
5.60
BALL A1
8.00 ±0.10
4.00 ±0.05
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS 0.35mm ON A
0.30mm SMD BALL PAD.
77X
0.35
SOLDER BALL MATERIAL:
EUTECTIC 62% Sn, 36% Pb, 2% Ag
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
7.20
3.60 ±0.05
5.00 ±0.05
10.00 ±0.10
CL
Table 9:
References
DEVICE
PART NUMBER
LINK
Flash
MT28F644W18/W30
CellularRAM
MT45W2MW16PFA and
MT45W4MW16PFA
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