參數(shù)資料
型號: MSM7715
廠商: OKI SEMICONDUCTOR CO., LTD.
英文描述: Multi-Function Telecommunication LSI
中文描述: 多功能通信大規(guī)模集成電路
文件頁數(shù): 21/21頁
文件大?。?/td> 150K
代理商: MSM7715
Semiconductor
MSM7715
21/21
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
m
m or more
0.41 TYP.
QFP44-P-910-0.80-2K
Mirror finish
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