參數(shù)資料
型號: MSM63V89C
廠商: OKI SEMICONDUCTOR CO., LTD.
英文描述: 1,048,576-Word x 1-Bit Solid-State Recorder Data Register(1M×1固體話音寄存器)
中文描述: 1,048,576字× 1位固態(tài)記錄器數(shù)據(jù)寄存器(1米× 1固體話音寄存器)
文件頁數(shù): 10/10頁
文件大小: 124K
代理商: MSM63V89C
Semiconductor
MSM63V89C
10/10
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
TSOP
II
26/20-P-300-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
m
m or more
0.38 TYP.
Mirror finish
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