參數(shù)資料
型號: MSC8144SVT1000A
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 數(shù)字信號處理
英文描述: 133 MHz, OTHER DSP, PBGA783
封裝: 29 X 29 MM, LEAD FREE, PLASTIC, FCPBGA-783
文件頁數(shù): 64/80頁
文件大?。?/td> 1250K
代理商: MSC8144SVT1000A
Hardware Design Considerations
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 16
Freescale Semiconductor
67
3.3
Clock and Timing Signal Board Layout Considerations
When laying out the system board, use the following guidelines:
Keep clock and timing signal paths as short as possible and route with 50
Ω impedance.
Use a serial termination resistor placed close to the clock buffer to minimize signal reflection. Use the following
equation to compute the resistor value:
Rterm = Rim – Rbuf
where Rim = trace characteristic impedance
Rbuf = clock buffer internal impedance.
Note:
See MSC8144 CLKIN and PCI_CLK_IN Board Layout (AN3440) for an example layout.
3.4
Connectivity Guidelines
Note:
Although the package actually uses a ball grid array, the more conventional term pin is used to denote signal
connections in this discussion.
First, select the pin multiplexing mode to allocate the required I/O signals. Then use the guidelines presented in the following
subsections for board design and connections. The following conventions are used in describing the connectivity requirements:
1.
GND indicates using a 10 k
Ω pull-down resistor (recommended) or a direct connection to the ground plane. Direct
connections to the ground plane may yield DC current up to 50mA through the I/O supply that adds to overall power
consumption.
2.
VDD indicates using a 10 kΩ pull-up resistor (recommended) or a direct connection to the appropriate power supply.
Direct connections to the supply may yield DC current up to 50mA through the I/O supply that adds to overall power
consumption.
3.
Mandatory use of a pull-up or pull-down resistor it is clearly indicated as “pull-up/pull-down”.
4.
NC indicates “not connected” and means do not connect anything to the pin.
5.
The phrase “in use” indicates a typical pin connection for the required function.
Note:
Please see recommendations #1 and #2 as mandatory pull-down or pull-up connection for unused pins in case of
subset interface connection.
3.4.1
DDR Memory Related Pins
This section discusses the various scenarios that can be used with DDR1 and DDR2 memory.
Note:
For information about unused differential/non-differential pins in DDR1/DDR2 modes (that is, unused negative lines
of strobes in DDR1), please refer to Table 51.
3.4.1.1
DDR Interface Is Not Used
Table 51. Connectivity of DDR Related Pins When the DDR Interface Is Not Used
Signal Name
Pin Connection
MDQ[0–31]
NC
MDQS[0–3]
NC
MDQS[0–3]
NC
MA[0–15]
NC
MCK[0–2]
NC
MCK[0–2]
NC
MCS[0–1]
NC
相關(guān)PDF資料
PDF描述
MSC8144TVT1000A 133 MHz, OTHER DSP, PBGA783
MSC8144SVT1000B 133 MHz, OTHER DSP, PBGA783
MSC8144VT1000A 133 MHz, OTHER DSP, PBGA783
MSC8144SVT800A 133 MHz, OTHER DSP, PBGA783
MSC8156SVT1000B 0-BIT, OTHER DSP, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSC8144SVT1000B 制造商:Freescale Semiconductor 功能描述:ENCRYPTION PACSUN R2.1 783FCPBGA 制造商:Freescale Semiconductor 功能描述:PACSUN REV2.1 NON-E
MSC8144SVT800A 功能描述:IC DSP QUAD 800MHZ 783FCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:StarCore 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C,McASP,McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
MSC8144SVT800B 制造商:Freescale Semiconductor 功能描述:PACSUN REV2.1 NON-E - Bulk 制造商:Freescale Semiconductor 功能描述:ENCRYPTION PACSUN R2.1 783FCPBGA
MSC8144TVT1000A 功能描述:IC DSP QUAD 1GHZ 783FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:StarCore 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C,McASP,McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
MSC8144TVT1000B 制造商:Freescale Semiconductor 功能描述:PACSUN REV2.1 NON-E - Bulk 制造商:Freescale Semiconductor 功能描述:ENCRYPTION PACSUN R2.1 783FCPBGA