
3–124
Motorola Sensor Device Data
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ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates the Differential/Gauge basic chip car-
rier (Case 867). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the sensor diaphragm.
(For use of the MPX5700D in a high pressure, cyclic ap-
plication, consult the factory.)
The MPX5700 series pressure sensor operating character-
istics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media, other than dry
air, may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information
regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0
°
to
85
°
C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
DIFFERENTIAL PRESSURE (kPa)
Figure 2. Output versus Pressure Differential
5.0
4.0
3.0
2.0
0
700
300
0
500
4.5
3.5
2.5
1.5
100
1.0
0.5
600
200
800
400
TYPICAL
O
TRANSFER FUNCTION:
Vout = VS*0.0012858*P+0.04)
±
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
MAX
MIN
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
FLUORO SILICONE
DIE COAT
LEAD
FRAME
STAINLESS STEEL
METAL COVER
RTV DIE
BOND
DIE
EPOXY CASE
WIRE BOND
Figure 3. Cross–Sectional Diagram
(Not to Scale)
P1
P2
Figure 4. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
1.0 F
IPS
470 pF
OUTPUT
Vs
5 V
0.01 F
GND
Vout
F
Freescale Semiconductor, Inc.
n
.