參數(shù)資料
型號: MPC862P
廠商: Motorola, Inc.
英文描述: XC2VP20-6FFG896C
中文描述: 硬件規(guī)格
文件頁數(shù): 84/88頁
文件大小: 1104K
代理商: MPC862P
84
MPC862/857T/857DSL Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Mechanical Data and Ordering Information
14.2
Mechanical Dimensions of the PBGA Package
For more information on the printed circuit board layout of the PBGA package, including thermal via design
and suggested pad layout, please refer to
Plastic Ball Grid Array Application Note
(order number:
AN1231/D) available from your local Motorola sales office. Figure 78 shows the mechanical dimensions of
the PBGA package.
KAPWR
R1
Power
GND
F6, F7, F8, F9, F10, F11, F12, F13, F14, G6, G7, G8, G9, G10, G11,
G12, G13, G14, H6, H7, H8, H9, H10, H11, H12, H13, H14, J6, J7,
J8, J9, J10, J11, J12, J13, J14, K6, K7, K8, K9, K10, K11, K12, K13,
K14, L6, L7, L8, L9, L10, L11, L12, L13, L14, M6, M7, M8, M9, M10,
M11, M12, M13, M14, N6, N7, N8, N9, N10, N11, N12, N13, N14,
P6, P7, P8, P9, P10, P11, P12, P13, P14
Power
VDDL
A8, M1, W8, H19, F4, F16, P4, P16
Power
VDDH
E5, E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, F5, F15, G5,
G15, H5, H15, J5, J15, K5, K15, L5, L15, M5, M15, N5, N15, P5,
P15, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, T14
Power
N/C
D6, D13, D14, U2, V2
No-connect
1
Classic SAR mode only
2
ESAR mode only
Table 35. Pin Assignments (continued)
Name
Pin Number
Type
F
Freescale Semiconductor, Inc.
n
.
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