參數(shù)資料
型號(hào): MPC860
廠商: MOTOROLA INC
元件分類(lèi): 微控制器/微處理器
英文描述: Family Hardware Specifications
中文描述: 4 CHANNEL(S), 10M bps, LOCAL AREA NETWORK CONTROLLER, PBGA357
封裝: BGA-357
文件頁(yè)數(shù): 2/76頁(yè)
文件大?。?/td> 857K
代理商: MPC860
2
MPC860 Family Hardware Specifications
MOTOROLA
Features
MPC8xx core that incorporates memory management units (MMUs) and instruction and
data caches and that implements the PowePC instruction set. The communications
processor module (CPM) from the MC68360 QUICC has been enhanced by the addition of
the inter-integrated controller (I
2
C) channel. The memory controller has been enhanced,
enabling the MPC860 to support any type of memory, including high-performance
memories and new types of DRAMs. A PCMCIA socket controller supports up to two
sockets. A real-time clock has also been integrated.
Table 1 shows the functionality supported by the members of the MPC860 family.
Part II Features
The following list summarizes the key MPC860 features:
Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC
architecture) with thirty-two 32-bit general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch, without
conditional execution
— 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
– 16-Kbyte instruction caches are four-way, set-associative with 256 sets;
4-Kbyte instruction caches are two-way, set-associative with 128 sets.
– 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data
caches are two-way, set-associative with 128 sets.
– Cache coherency for both instruction and data caches is maintained on 128-bit
(4-word) cache blocks.
Table 1. MPC860 Family Functionality
Part
Cache (Kbytes)
Ethernet
ATM
SCC
Ref.
1
1
Supporting documentation for these devices refers to the following:
1. MPC860 PowerQUICC User’s Manual (MPC860UM/D, Rev. 1).
2. MPC8XX ATM Supplement (MPC860SARUM/AD).
3. MPC860T (Rev. D), Fast Ethernet Controller Supplement (MPC860TREVDSUPP).
4. MPC855T User’s Manual (MPC855TUM/D, Rev. 1).
Instruction
Cache
Data Cache
10T
10/100
MPC860DE
4
4
Up to 2
2
1
MPC860DT
4
4
Up to 2
1
yes
2
1,2,3
MPC860DP
16
8
Up to 2
1
yes
2
1,2,3
MPC860EN
4
4
Up to 4
4
1
MPC860SR
4
4
Up to 4
yes
4
1,2
MPC860T
4
4
Up to 4
1
yes
4
1,2,3
MPC860P
16
8
Up to 4
1
yes
4
1,2,3
MPC855T
4
4
1
1
yes
1
4
相關(guān)PDF資料
PDF描述
MPC855T Family Hardware Specifications
MPC860DE Family Hardware Specifications
MPC860DP Family Hardware Specifications
MPC860DT Family Hardware Specifications
MPC860EN Family Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC860DECVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DECVR66D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DECZQ50D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DECZQ66D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DEVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324