參數(shù)資料
型號: MPC859TVR100A
廠商: Freescale Semiconductor
文件頁數(shù): 15/96頁
文件大小: 0K
描述: IC MPU POWERQUICC 100MHZ 357PBGA
標準包裝: 44
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 100MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 357-BBGA
供應商設備封裝: 357-PBGA(25x25)
包裝: 托盤
MPC866/MPC859 Hardware Specifications, Rev. 2
22
Freescale Semiconductor
Bus Signal Timing
B31d CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM EBDF
= 1 (MAX = 0.375 x B1 + 6.6)
13.30
18.00
11.30
16.00
9.40
14.10
7.60
12.30
ns
B32
CLKOUT falling edge to BS valid, as
requested by control bit BST4 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF
= 0 (MAX = 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B32b CLKOUT rising edge to BS valid, as
requested by control bit BST2 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c CLKOUT rising edge to BS valid, as
requested by control bit BST3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B32d CLKOUT falling edge to BS valid- as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF
= 1 (MAX = 0.375 x B1 + 6.60)
13.30
18.00
11.30
16.00
9.40
14.10
7.60
12.30
ns
B33
CLKOUT falling edge to GPL valid, as
requested by control bit GxT4 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B33a CLKOUT rising edge to GPL valid, as
requested by control bit GxT3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B34
A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by control bit
CST4 in the corresponding word in the
UPM (MIN = 0.25 x B1 - 2.00)
5.60
4.30
3.00
1.80
ns
B34a A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by control bit
CST1 in the corresponding word in the
UPM (MIN = 0.50 x B1 – 2.00)
13.20
10.50
8.00
5.60
ns
B34b A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by CST2 in
the corresponding word in UPM (MIN =
0.75 x B1 – 2.00)
20.70
16.70
13.00
9.40
ns
Table 9. Bus Operation Timings (continued)
Num
Characteristic
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
相關PDF資料
PDF描述
HFW18R-1STE1LF CONN FPC/FFC 18POS 1MM R/A SMD
MPC8358ZQADDDA IC MPU POWERQUICC II PRO 668PBGA
MPC8358VRADDDA IC MPU POWERQUICC II PRO 668PBGA
MC68302EH16CB1 IC MPU NETWORK 16MHZ 132-PQFP
MC68302EH16CR2 IC MPU NETWORK 16MHZ 132-PQFP
相關代理商/技術參數(shù)
參數(shù)描述
MPC859TVR133A 功能描述:微處理器 - MPU POWERQUICC I HIP6W NO PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TZP100A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC859TZP133A 功能描述:微處理器 - MPU POWER QUICC I HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DECVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860DECVR66D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324