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參數(shù)資料
| 型號(hào)： | MPC8572CPXAVLD |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1500 MHz, MICROPROCESSOR, PBGA1023 |
| 封裝： | 33 X 33 MM, PLASTIC, FCBGA-1023 |
| 文件頁數(shù)： | 57/138頁 |
| 文件大?。?/td> | 1502K |
| 代理商： | MPC8572CPXAVLD |
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MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
25
DDR2 and DDR3 SDRAM Controller
NOTE
For the ADDR/CMD setup and hold specifications in Table 17, it is
assumed that the clock control register is set to adjust the memory clocks by
1/2 applied cycle.
<= 667 MHz
tDDKHME
–0.6
0.6
ns
6
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can
be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went
invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference
(K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR
timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data
output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR
timing (DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be
modified through control of the MDQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register.
This will typically be set to the same delay as in DDR_SDRAM_CLK_CNTL[CLK_ADJUST]. The timing parameters
listed in the table assume that these 2 parameters have been set to the same adjustment value. See the
MPC8572E
PowerQUICC III Integrated Host Processor Family Reference Manual for a description and understanding of the
timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ),
ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the
microprocessor.
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows
the symbol conventions described in note 1.
Table 17. DDR2 and DDR3 SDRAM Interface Output AC Timing Specifications (continued)
At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.
Parameter
Symbol 1
Min
Max
Unit
Notes
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