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參數(shù)資料
| 型號： | MPC8548EHXAUG |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1333 MHz, MICROPROCESSOR, CBGA783 |
| 封裝： | 29 X 29 MM, 1 MM PITCH, FLIP CHIP, CERAMIC, BGA-783 |
| 文件頁數(shù)： | 32/142頁 |
| 文件大小： | 1504K |
| 代理商： | MPC8548EHXAUG |
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MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
127
System Design Information
20.3
Heat Sink Solution
Every system application has different conditions that the thermal management solution must solve. As
such, providing a recommended heat sink has not been found to be very useful. When a heat sink is chosen,
give special consideration to the mounting technique. Mounting the heat sink to the printed-circuit board
is the recommended procedure using a maximum of 10 lbs force (45 Newtons) perpendicular to the
package and board. Clipping the heat sink to the package is not recommended.
21 System Design Information
This section provides electrical design recommendations for successful application of the MPC8548E.
21.1
System Clocking
This device includes five PLLs, as follows:
1. The platform PLL generates the platform clock from the externally supplied SYSCLK input. The
frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio
configuration bits as described in Section 19.2, “CCB/SYSCLK PLL Ratio.”
2. The e500 core PLL generates the core clock as a slave to the platform clock. The frequency ratio
between the e500 core clock and the platform clock is selected using the e500 PLL ratio
configuration bits as described in Section 19.3, “e500 Core PLL Ratio.”
3. The PCI PLL generates the clocking for the PCI bus.
4. The local bus PLL generates the clock for the local bus.
5. There is a PLL for the SerDes block.
Die junction-to-case
N/A
RθJC
0.8
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
Table 81. Package Thermal Characteristics for FC-PBGA (continued)
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8548EHXAUJ | 功能描述:微處理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8548EHXAVH | 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1.5GHZ 1.8V/2.5V/3.3V - Bulk |
| MPC8548EHXAVK | 制造商:Freescale Semiconductor 功能描述:PQ38 8548E - Bulk |
| MPC8548EPXANJB | 制造商:Freescale Semiconductor 功能描述:PQ38 8548 - Bulk |
| MPC8548EPXAQGA | 制造商:Freescale Semiconductor 功能描述:MPC85XX RISC 32-BIT CMOS 1GHZ 1.8V/2.5V/3.3V 783-PIN BGA TRA - Bulk |
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