參數(shù)資料
型號: MPC8548ECVTAUJB
廠商: Freescale Semiconductor
文件頁數(shù): 60/151頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 783-PBGA
產(chǎn)品培訓模塊: MPC8548 PowerQUICC III Processors
標準包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.333GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應商設備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
16
Freescale Semiconductor
Input Clocks
4
Input Clocks
This section discusses the timing for the input clocks.
4.1
System Clock Timing
The following table provides the system clock (SYSCLK) AC timing specifications for the device.
4.2
Real Time Clock Timing
The RTC input is sampled by the platform clock (CCB clock). The output of the sampling latch is then
used as an input to the counters of the PIC and the TimeBase unit of the e500. There is no jitter
specification. The minimum pulse width of the RTC signal must be greater than 2x the period of the CCB
clock. That is, minimum clock high time is 2
t
CCB, and minimum clock low time is 2 tCCB. There is
no minimum RTC frequency; RTC may be grounded if not needed.
Table 5. SYSCLK AC Timing Specifications
At recommended operating conditions (see Table 2) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
Notes
SYSCLK frequency
fSYSCLK
16
133
MHz
SYSCLK cycle time
tSYSCLK
7.5
60
ns
6, 7, 8
SYSCLK rise and fall time
tKH, tKL
0.6
1.0
1.2
ns
SYSCLK duty cycle
tKHK/tSYSCLK
40
60
%
SYSCLK jitter
±150
ps
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting
SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum
settings.
2. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The SYSCLK driver’s closed loop jitter bandwidth must be <500 kHz at –20 dB. The bandwidth must be set low to allow
cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter.
6. This parameter has been adjusted slower according to the workaround for device erratum GEN 13.
7. For spread spectrum clocking. Guidelines are + 0% to –1% down spread at modulation rate between 20 and 60 kHz on
SYSCLK.
8. System with operating core frequency less than 1200 MHz must limit SYSCLK frequency to 100 MHz maximum.
相關PDF資料
PDF描述
IDT7016L15J8 IC SRAM 144KBIT 15NS 68PLCC
IDT7006L20JI8 IC SRAM 128KBIT 20NS 68PLCC
IDT7006L20JGI8 IC SRAM 128KBIT 20NS 68PLCC
ASM22DRES CONN EDGECARD 44POS .156 EYELET
IDT7006L17J8 IC SRAM 128KBIT 17NS 68PLCC
相關代理商/技術參數(shù)
參數(shù)描述
MPC8548ECVTAUJC 功能描述:微處理器 - MPU REV2.1.3 FG Part RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548ECVTAUJD 功能描述:微處理器 - MPU PQ38 XT WE 1333 R3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548ECVUAQG 功能描述:微處理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548ECVUAUJ 功能描述:微處理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548EHXAQG 功能描述:微處理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324