參數(shù)資料
型號(hào): MPC8540VT667LB
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 2/24頁(yè)
文件大?。?/td> 0K
描述: ICMPU 32BIT 667MHZ PPC 783FCPBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 667MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 784-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
配用: MPC8540ADS-BGA-ND - BOARD APPLICATION DEV 8540
CWH-PPC-8540N-VE-ND - KIT EVAL SYSTEM MPC8540
MPC8540 PowerQUICC III Integrated Host Processor Product Brief, Rev. 0.1
10
Freescale Semiconductor
MPC8540 Architecture Overview
– Vector offset registers (IVORs) 0–15 as defined in Book E, plus e500-defined IVORs 32–35
– Exception syndrome register (ESR)
– Book E–defined preempting critical interrupt, including critical interrupt status registers (CSRR0
and CSRR1) and an rfci instruction
— e500-specific interrupts not defined in Book E architecture
– SPE APU unavailable exception
– Floating-point data exception
– Floating-point round exception
– Performance monitor
Memory management unit (MMU)
— Data L1 MMU
– Four-entry, fully-associative TLB array for variable-sized pages
– 64-entry, four-way set-associative TLB for 4-Kbyte pages
— Instruction L1 MMU
– Four-entry, fully-associative TLB array for variable-sized pages
– 64-entry, four-way set-associative TLB for 4-Kbyte pages
— Unified L2 MMU
– 16-entry, fully-associative TLB array for variable-sized pages
– 256-entry, two-way set-associative TLB for 4-Kbyte pages
— Software reload for TLBs
— Virtual memory support for as much as 4 Gbytes (232) of virtual memory
— Real memory support for as much as 4 Gbytes (2
32) of physical memory
— Support for big-endian and true little-endian memory on a per-page basis
Power management
— Low power, 1.2-V design
— Dynamic power management on the core minimizes power consumption of functional units, such as
execution units, caches, and MMUs, when they are idle.
— Core power-saving modes: core-halted and core-stopped
— NAP, DOZE, and SLEEP bits in HID0 that can be used to assert nap, doze, and sleep core output signals
to initiate power-saving modes at the integrated-device level
— Internal clock multipliers of 2x, 2.5x, and 3x from bus clock
Testability
— LSSD scan design
— JTAG interface
— ESP support
— ABIST for arrays
—LBIST
Reliability and serviceability
— Internal code parity
— Parity checking on e500 local bus
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