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參數(shù)資料
| 型號： | MPC8360CVVAJDHA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740 |
| 封裝： | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740 |
| 文件頁數(shù)： | 97/102頁 |
| 文件大?。?/td> | 606K |
| 代理商： | MPC8360CVVAJDHA |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
94
Freescale Semiconductor
Thermal Management Information
This table shows heat sinks and junction-to-ambient thermal resistance for TBGA package.
Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics
software which can model both the conduction cooling and the convection cooling of the air moving through the application.
Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal
resistances listed in the thermal resistance table. More detailed thermal models can be made available on request.
Heat sink vendors include the following:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Table 78. Heat Sinks and Junction-to-Ambient Thermal Resistance of TBGA Package
Heat Sink Assuming Thermal Grease
Airflow
35
× 35 mm TBGA
Junction-to-Ambient
Thermal Resistance
AAVID 30 × 30 × 9.4 mm pin fin
Natural convention
10.7
AAVID 30 × 30 × 9.4 mm pin fin
1 m/s
6.2
AAVID 30 × 30 × 9.4 mm pin fin
2 m/s
5.3
AAVID 31 × 35 × 23 mm pin fin
Natural convention
8.1
AAVID 31 × 35 × 23 mm pin fin
1 m/s
4.4
AAVID 31 × 35 × 23 mm pin fin
2 m/s
3.7
Wakefield, 53 × 53 × 25 mm pin fin
Natural convention
5.4
Wakefield, 53 × 53 × 25 mm pin fin
1 m/s
3.2
Wakefield, 53 × 53 × 25 mm pin fin
2 m/s
2.4
MEI, 75 × 85 × 12 no adjacent board, extrusion
Natural convention
6.4
MEI, 75 × 85 × 12 no adjacent board, extrusion
1 m/s
3.8
MEI, 75 × 85 × 12 no adjacent board, extrusion
2 m/s
2.5
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
1 m/s
2.8
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8360CVVAJFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVAJFHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVALDGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVALDHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVALFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
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