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參數(shù)資料
| 型號： | MPC8360CVVAJDHA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740 |
| 封裝： | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740 |
| 文件頁數(shù)： | 100/102頁 |
| 文件大?。?/td> | 606K |
| 代理商： | MPC8360CVVAJDHA |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
97
Decoupling Recommendations
This figure shows the PLL power supply filter circuit.
Figure 56. PLL Power Supply Filter Circuit
23.3
Decoupling Recommendations
Due to large address and data buses as well as high operating frequencies, the device can generate transient power surges and
high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from
reaching other components in the device system, and the device itself requires a clean, tightly regulated source of power.
Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD, OVDD, GVDD, and
LVDD pins of the device. These decoupling capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and
GND power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed directly under the device
using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology) capacitors should be
used to minimize lead inductance, preferably 0402 or 0603 sizes.
Additionally, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD,
OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have
a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to
the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS
tantalum or Sanyo OSCON).
23.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. Unused active
low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high inputs should be connected to GND. All
NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of the device.
23.5
Output Buffer DC Impedance
The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended
driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD or GND. Then, the
value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 57). The output impedance is the average of two
components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open) and
RP is trimmed until the voltage at the pad equals OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are
designed to be close to each other in value. Then, Z0 = (RP + RN)/2.
VDD
AVDDn
2.2 F
GND
Low ESL Surface Mount Capacitors
10
Ω
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8360CVVAJFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVAJFHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVALDGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVALDHA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360CVVALFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
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