參數(shù)資料
型號(hào): MPC8314EVRADDA
廠(chǎng)商: Freescale Semiconductor
文件頁(yè)數(shù): 12/101頁(yè)
文件大小: 0K
描述: MPU POWERQUICC II PRO 620-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC83xx
處理器類(lèi)型: 32-位 MPC83xx PowerQUICC II Pro
速度: 266MHz
電壓: 1V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 620-BBGA 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 620-PBGA(29x29)
包裝: 托盤(pán)
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
18
Freescale Semiconductor
DDR and DDR2 SDRAM
7.2
DDR and DDR2 SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface.
7.2.1
DDR and DDR2 SDRAM Input AC Timing Specifications
This table lists the input AC timing specifications for the DDR2 SDRAM (GVDD(typ) = 1.8 V).
This table lists the input AC timing specifications for the DDR SDRAM when GVDD(typ)=2.5 V.
The following two tables list the input AC timing specifications for the DDR SDRAM interface.
Note:
1. The voltage regulator for MVREF must be able to supply up to 500 A current.
Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions with GVDD of 1.8V ± 100 mV
Parameter
Symbol
Min
Max
Unit
Note
AC input low voltage
VIL
MVREF – 0.45
V
AC input high voltage
VIH
MVREF + 0.45
V
Table 17. DDR SDRAM Input AC Timing Specifications for 2.5 V Interface
At recommended operating conditions with GVDD of 2.5V ± 200 mV
Parameter
Symbol
Min
Max
Unit
Note
AC input low voltage
VIL
MVREF – 0.51
V
AC input high voltage
VIH
MVREF + 0.51
V
Table 18. DDR2 SDRAM Input AC Timing Specifications
At recommended operating conditions with GVDD of (1.8 V± 100 mV)
Parameter
Symbol
Min
Max
Unit
Note
Controller Skew for MDQS—MDQ
266 MHz
200 MHz
tCISKEW
–875
–1250
875
1250
ps
1, 2, 3
Note:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit to
be captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW.This can be
determined by the following equation: tDISKEW =+/–(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is
the absolute value of tCISKEW.
3. Memory controller ODT value of 150
is recommended.
Table 19. DDR SDRAM Input AC Timing Specifications
At recommended operating conditions with GVDD of (2.5V ± 200 mV)
Parameter
Symbol
Min
Max
Unit
Note
Table 15. Current Draw Characteristics for MVREF
Parameter / Condition
Symbol
Min
Max
Unit
Note
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MPC8314EVRAFDA 功能描述:微處理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314EVRAGDA 功能描述:微處理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314VRADDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314VRAFDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314VRAGDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324