- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4073 > MPC8313ECZQADDB (Freescale Semiconductor)MPU POWERQUICC II PRO 516-PBGA PDF資料下載
參數(shù)資料
| 型號： | MPC8313ECZQADDB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 98/99頁 |
| 文件大?。?/td> | 0K |
| 描述： | MPU POWERQUICC II PRO 516-PBGA |
| 標準包裝： | 40 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 267MHz |
| 電壓： | 0.95 V ~ 1.05 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 516-PBGAPGE（27x27） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁當前第98頁第99頁
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
98
Freescale Semiconductor
1
3/2008
In Table 63, added LBC_PM_REF_10 & LSRCID3 as muxed with USBDR_PCTL1
In Table 63, added LSRCID2 as muxed with USBDR_PCTL0
In Table 63, added LSRCID1 as muxed with USBDR_PWRFAULT
In Table 63, added LSRCID0 as muxed with USBDR_DRIVE_VBUS
In Table 63, moved T1, U2,& V2 from VDD to XCOREVDD.
In Table 63, moved P2, R2, & T3 from VSS to XCOREVSS.
In Table 63, moved P5, & U4 from VDD to XPADVDD.
In Table 63, moved P3, & V4 from VSS to XPADVSS.
In Table 63, removed “Double with pad” for AVDD1 and AVDD2 and moved AVDD1 and AVDD2 to Power
and Ground Supplies section
In Table 63, added impedance control requirements for SD_IMP_CAL_TX (100 ohms to GND) and
SD_IMP_CAL_RX (200 ohms to GND).
In Table 63, updated muxing in pinout to show new options for selecting IEEE 1588 functionality. Added
footnote 8
In Table 63, updated muxing in pinout to show new LBC ECC boot enable control muxed with
eTSEC1_MDC
Added pin type information for power supplies.
Removed N1 and N3 from Vss section of Table 63. Added Therm0 and Therm1 (N1 and N3,
respectively). Added note 7 to state: “Internal thermally sensitive resistor, resistor value varies linearly
with temperature. Useful for determining the junction temperature.”
In Table 65 corrected maximum frequency of Local Bus Frequency from “33–66” to 66 MHz
In Table 65 corrected maximum frequency of PCI from “24–66” to 66 MHz
Added “which is determined by RCWLR[COREPLL],” to the note in Section 20.2, “Core PLL
Configuration” about the VCO divider.
Added “(VCOD)” next to VCO divider column in Table 68. Added footnote stating that core_clk
frequency must not exceed its maximum, so 2.5:1 and 3:1 core_clk:csb_clk ratios are invalid for certain
csb_clk values.
In Table 69, notes were confusing. Added note 3 for VCO column, note 4 for CSB (csb_clk) column,
note 5 for USB ref column, and note 6 to replace “Note 1”. Clarified note 4 to explain erratum eTSEC40.
In Table 69, updated note 6 to specify USB reference clock frequencies limited to 24 and 48 for rev. 2
silicon.
Replaced Table 71 “Thermal Resistance for TEPBGAII with Heat Sink in Open Flow”.
Removed last row of Table 19.
Removed 200 MHz rows from Table 21 and Table 5.
Changed VIH minimum spec from 2.0 to 2.1 for clock, PIC, JTAG, SPI, and reset pins in Table 9,
Table 47, Table 54, Table 59, and Table 61.
Added Figure 4 showing the DDR input timing diagram.
In Table 19, removed “MDM” from the “MDQS-MDQ/MECC/MDM” text under the Parameter
column for the tCISKEW parameter. MDM is an output signal and should be removed from
the input AC timing spec table (tCISKEW).
Added “and power” to rows 2 and 3 in Table 10
Added the sentence “Once both the power supplies...” and PORESET to Section 2.2, “Power
Sequencing,” and Figure 3.
In Figure 35, corrected “USB0_CLK/USB1_CLK/DR_CLK” with “USBDR_CLK”
In Table 42, clarified that AC specs are for ULPI only.
0
6/2007
Initial release.
Table 73. Document Revision History (continued)
Rev.
Number
Date
Substantive Change(s)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IDT71V65803S133BGI | IC SRAM 9MBIT 133MHZ 119BGA |
| MPC8313ECVRADDB | MPU POWERQUICC II PRO 516-PBGA |
| FMC36DRYN-S13 | CONN EDGECARD 72POS .100 EXTEND |
| IDT71V65803S133BGGI | IC SRAM 9MBIT 133MHZ 119BGA |
| M68LC302CAF16VCT | IC MPU MULTI PROTOCOL 100-LQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8313ECZQADDC | 功能描述:微處理器 - MPU 8313 REV2.2 PB ENC EXT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8313ECZQAFD | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313ECZQAFDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313ECZQAFDB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313ECZQAFF | 功能描述:微處理器 - MPU 8313 PB PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復。