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| 型號(hào)： | MPC826XAVR |
| 廠商： | Motorola, Inc. |
| 英文描述： | Hardware Specifications |
| 中文描述： | 硬件規(guī)格 |
| 文件頁(yè)數(shù)： | 11/48頁(yè) |
| 文件大?。?/td> | 662K |
| 代理商： | MPC826XAVR |
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MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
11
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature
,
T
J
,
in
°
C can be obtained from the following:
T
J
= T
A
+ (P
D
x
θ
JA
)
(1)
where
T
A
= ambient temperature
°
C
θ
JA
= package thermal resistance
,
junction to ambient
,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
x
V
DD
Watts (chip internal power)
P
I/O
= power dissipation on input and output pins (determined by user)
For most applications P
I/O
< 0.3
x
P
INT
. If P
I/O
is neglected
,
an approximate relationship between P
D
and T
J
is the following:
P
D
= K/(T
J
+ 273
°
C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
x
(T
A
+ 273
°
C) +
θ
JA
x
P
D2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
P
D
(at equilibrium) for a known T
A
. Using this value of K
,
the values of P
D
and T
J
can be obtained by solving
equations (1) and (2) iteratively for any value of T
A
.
Table 4. Thermal Characteristics for 480 TBGA Package
Characteristics
Symbol
Value
Unit
Air Flow
Junction to ambient
θ
JA
13
1
1
Assumes a single layer board with no thermal vias
2
Natural convection
3
Assumes a four layer board
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
°
C/W
NC
2
10
1
1 m/s
11
3
NC
8
3
1 m/s
Junction to board
4
θ
JB
4
°
C/W
—
Junction to case
5
θ
JC
1.1
°
C/W
—
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