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參數(shù)資料
| 型號： | MPC8245LZU300X |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY DOWN, TBGA-352 |
| 文件頁數(shù)： | 49/60頁 |
| 文件大小： | 620K |
| 代理商： | MPC8245LZU300X |
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MPC8245 Integrated Processor Hardware Specications
53
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
For preliminary heat sink sizing, the heat sink base-to-ambient thermal resistance is needed from the heat
sink manufacturer.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
gure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ow. The nal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the nal operating die-junction temperature—airow, board population (local heat
ux of adjacent components), heat sink efciency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs.
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