參數(shù)資料
型號(hào)： MPC8241LVR266D
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
封裝： 25 X 25 MM, 1.27 MM HEIGHT, LEAD FREE, PLASTIC, BGA-357
文件頁(yè)數(shù)： 57/64頁(yè)
文件大?。?/td> 827K
代理商： MPC8241LVR266D
60
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Ordering Information
9.2 Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications that supplement and supersede this document (see
Table 22. Part Numbers Addressed by MPC8241TXXPNS Series
Table 21. Part Numbering Nomenclature
XPC
nnnn
L
xx
nnn
x
Product
Code
Part
Identifier
Process Descriptor
Package 1, 3
Processor
Frequency 2
(MHz)
Revision
Level
Processor
Version
Register
Value
MPC
8241
L = Standard Spec.
1.8 V ± 100 mV
0
° to 105°C
ZP = PBGA
166
200
B:1.2
Rev. ID:0x12
0x80811014
ZQ = thick substrate and
thick mold cap PBGA
VR = Lead free version of
package
166
200
266
D:1.4
Rev. ID:0x14
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support
other maximum core frequencies.
3. ZP packaging is only available for Rev. B (1.2) devices. Note that the 266-MHz part is only offered as a Rev. D part.
XPC
nnnn
L
xx
nnn
x
Product
Code
Part
Identifier
Process Descriptor
Package 1, 3
Processor
Frequency 2
(MHz)
Revision
Level
Processor
Version
Register
Value
MPC
8241
T = Extended
Temperature Spec.
1.8 V ± 100 mV
-40
° to 105°C
ZP =PBGA
166
200
B:1.2
Rev. ID:0x12
0x80811014
ZQ = thick substrate and
thick mold cap PBGA
VR = Lead free version of
package
166
200
266
D:1.4
Rev. ID:0x14
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support
other maximum core frequencies.
3. ZP packaging is only available for Rev. B (1.2) devices. Note that the 266-MHz part is only offered as a Rev. D part.
相關(guān)PDF資料
PDF描述
MPC8241LZQ166D 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZP166B 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ266D 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZP266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ166B 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8241LZQ166D 功能描述:微處理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357
MPC8241LZQ266D 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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