參數(shù)資料
型號(hào)： MPC8241LVR266D
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
封裝： 25 X 25 MM, 1.27 MM HEIGHT, LEAD FREE, PLASTIC, BGA-357
文件頁(yè)數(shù)： 51/64頁(yè)
文件大小： 827K
代理商： MPC8241LVR266D
MOTOROLA
MPC8241 Integrated Processor Hardware Specifications
55
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
7.7.3 Heat Sink Usage
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, two values are in common usage: the value determined
on a single-layer board and the value obtained on a board with two planes. For packages such as the PBGA,
these values can be different by a factor of two. Which value is closer to the application depends on the
power dissipated by other components on the board. The value obtained on a single-layer board is
appropriate for the tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit
board, or the thermal dissipation on the printed-circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
thermal characterization parameter (
ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ψJT × PD)
where:
TT = thermocouple temperature atop the package (°C)
ψJT = thermal characterization parameter (°C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that
the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat
against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire.
相關(guān)PDF資料
PDF描述
MPC8241LZQ166D 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZP166B 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ266D 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZP266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ166B 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8241LZQ166D 功能描述:微處理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357
MPC8241LZQ266D 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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