參數(shù)資料
型號: MPC755CVT400
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
封裝: 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360
文件頁數(shù): 27/56頁
文件大小: 1521K
代理商: MPC755CVT400
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
33
Package Description
7.1
Package Parameters for the MPC745 PBGA
The package parameters are as provided in the following list. The package type is 21
× 21 mm, 255-lead
plastic ball grid array (PBGA).
Package outline
21
× 21 mm
Interconnects
255 (16
× 16 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.25 mm
Maximum module height
2.80 mm
Ball diameter (typical)
0.75 mm (29.5 mil)
7.2
Mechanical Dimensions for the MPC745 PBGA
Figure 18 provides the mechanical dimensions and bottom surface nomenclature for the MPC745,
255 PBGA package.
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC745,
255 PBGA Package
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
4. CAPACITOR PADS MAY BE
UNPOPULATED.
Millimeters
DIM
Min
Max
A
2.25
2.80
A1
0.50
0.70
A2
1.00
1.20
A3
—0.60
b
0.60
0.90
D
21.00 BSC
D1
6.75
E
21.00 BSC
E1
7.87
e
1.27 BSC
0.2
D
2X
A1 CORNER
E
0.2
B
A
C
0.2 C
B
C
255X
e
123456789 10 111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
C
0.15
b
E1
D1
A
A1
A2
A3
1
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