參數(shù)資料
型號： MPC755CRX400
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù)： 9/56頁
文件大小： 1521K
代理商： MPC755CRX400
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
17
Electrical and Thermal Characteristics
SRAM. Note that revisions of the MPC755 prior to Rev. 2.8 (Rev. E) were limited in performance, and
were typically limited to 175 MHz with similarly-rated SRAM. For more information, see Section 10.2,
Freescale is similarly limited by system constraints and cannot perform tests of the L2 interface on a
socketed part on a functional tester at the maximum frequencies of Table 11. Therefore, functional
operation and AC timing information are tested at core-to-L2 divisors of 2 or greater. Functionality of
core-to-L2 divisors of 1 or 1.5 is verified at less than maximum rated frequencies.
L2 input and output signals are latched or enabled, respectively, by the internal L2CLK (which is SYSCLK
multiplied up to the core frequency and divided down to the L2CLK frequency). In other words, the AC
timings of Table 12 and Table 13 are entirely independent of L2SYNC_IN. In a closed loop system, where
L2SYNC_IN is driven through the board trace by L2SYNC_OUT, L2SYNC_IN only controls the output
phase of L2CLK_OUTA and L2CLK_OUTB which are used to latch or enable data at the SRAMs.
However, since in a closed loop system L2SYNC_IN is held in phase alignment with the internal L2CLK,
the signals of Table 12 and Table 13 are referenced to this signal rather than the not-externally-visible
internal L2CLK. During manufacturing test, these times are actually measured relative to SYSCLK.
The L2SYNC_OUT signal is intended to be routed halfway out to the SRAMs and then returned to the
L2SYNC_IN input of the MPC755 to synchronize L2CLK_OUT at the SRAM with the processor’s
internal clock. L2CLK_OUT at the SRAM can be offset forward or backward in time by shortening or
lengthening the routing of L2SYNC_OUT to L2SYNC_IN. See Freescale Application Note AN1794/D,
Backside L2 Timing Analysis for PCB Design Engineers.
The L2CLK_OUTA and L2CLK_OUTB signals should not have more than two loads.
相關PDF資料
PDF描述
MPC745BPX300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC755CVT400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BPX350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA360
MPC755CRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC755CPX400LER2 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
相關代理商/技術參數(shù)
參數(shù)描述
MPC755CRX400LE 功能描述:微處理器 - MPU GF RV2.84A105C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX400TE 功能描述:微處理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CVT350LE 功能描述:微處理器 - MPU GF RV2.8,4A,105C,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CVT400LE 功能描述:微處理器 - MPU GF RV2.84A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC76 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*