參數(shù)資料
型號: MPC755CRX400
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 49/56頁
文件大小: 1521K
代理商: MPC755CRX400
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
53
Ordering Information
10 Ordering Information
Ordering information for the devices fully covered by this specification document is provided in
correspond to a maximum processor core frequency. For available frequencies, contact your local
Freescale sales office. In addition to the processor frequency, the part numbering scheme also includes an
application modifier which may specify special application conditions. Each part number also contains a
revision code which refers to the die mask revision number. Section 10.2, “Part Numbers Not Fully
Addressed by This Document,” lists the part numbers which do not fully conform to the specifications of
this document. These special part numbers require an additional document called a hardware specifications
addendum.
10.1
Part Numbers Fully Addressed by This Document
Table 20 provides the Freescale part numbering nomenclature for the MPC755 and MPC745 devices fully
addressed by this document.
Table 20. Part Numbering Nomenclature
MPC
xxx
x
xx
nnn
x
Product
Code
Part
Identifier
Process
Descriptor
Package 1
Processor
Frequency
Application Modifier
Revision Level
XPC2
755
745
B = HiP4DP
PX = PBGA
RX = CBGA
300
350
L: 2.0 V ± 100 mV
0
° to 105°C
E: 2.8; PVR = 0008 3203
755
C = HiP4DP
400
MPC
755
B = HiP4DP
300
350
C = HiP4DP
350
400
745
B = HiP4DP
PX = PBGA
300
350
745
C = HiP4DP
PX = PBGA
VT = PBGAPb-
free BGA
350
755
745
B = HiP4DP
VT = PBGAPb-
free BGA
300
350
755
C = HiP4DP
350
400
Notes:
1. See Section 7, “Package Description,” for more information on available package types.
2. The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13.
These are from a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified
technology to simulate normal production. These parts have only preliminary reliability and characterization data. Before
pilot production prototypes may be shipped, written authorization from the customer must be on file in the applicable
sales office acknowledging the qualification status and the fact that product changes may still occur while shipping pilot
production prototypes
相關(guān)PDF資料
PDF描述
MPC745BPX300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC755CVT400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BPX350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA360
MPC755CRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC755CPX400LER2 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755CRX400LE 功能描述:微處理器 - MPU GF RV2.84A105C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX400TE 功能描述:微處理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CVT350LE 功能描述:微處理器 - MPU GF RV2.8,4A,105C,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CVT400LE 功能描述:微處理器 - MPU GF RV2.84A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC76 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors