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參數(shù)資料
| 型號(hào)： | MPC755CPX400 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360 |
| 封裝： | 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 |
| 文件頁數(shù)： | 56/56頁 |
| 文件大小： | 1521K |
| 代理商： | MPC755CPX400 |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
9
Electrical and Thermal Characteristics
The MPC755 incorporates a thermal management assist unit (TAU) composed of a thermal sensor,
digital-to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See
the MPC750 RISC Microprocessor Family User’s Manual for more information on the use of this feature.
Specifications for the thermal sensor portion of the TAU are found in Table 5.
Table 4. Package Thermal Characteristics 6
Characteristic
Symbol
Value
Unit
Notes
MPC755
CBGA
MPC755
PBGA
MPC745
PBGA
Junction-to-ambient thermal resistance, natural
convection
RθJA
24
31
34
°C/W
1, 2
Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board
RθJMA
17
25
26
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min
airflow, single-layer (1s) board
RθJMA
18
25
27
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min
airflow, four-layer (2s2p) board
RθJMA
14
21
22
°C/W
1, 3
Junction-to-board thermal resistance
RθJB
817
17
°C/W
4
Junction-to-case thermal resistance
RθJC
<0.1
°C/W
5
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
6. Refer to Section 8.8, “Thermal Management Information,” for more details about thermal management.
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| MPC755CPX400LE | 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CPX400LE | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360 |
| MPC755CPX400LER2 | 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CRX350LE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CRX350TE | 功能描述:微處理器 - MPU 360CBGA,RV2.8, RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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