參數(shù)資料
型號： MPC755BRX400LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù)： 44/48頁
文件大?。?/td> 1265K
代理商： MPC755BRX400LX
MPC755 RISC Microprocessor Hardware Specifications
5
General Parameters
— Hardware reload for TLBs
— Hardware or optional software tablewalk support
— 8 instruction BATs and 8 data BATs
— 8 SPRGs, for assistance with software tablewalks
— Virtual memory support for up to 4 exabytes (252) of virtual memory
— Real memory support for up to 4 gigabytes (232) of physical memory
Bus Interface
— Compatible with 60X processor interface
— 32-bit address bus
— 64-bit data bus, 32-bit mode selectable
— Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x, 10x
supported
— Selectable interface voltages of 2.5 V and 3.3 V
— Parity checking on both address and data busses
Power management
— Low-power design with thermal requirements very similar to MPC740/750.
— Three static power saving modes: doze, nap, and sleep
— Dynamic power management
Integrated Thermal Management Assist Unit
— On-chip thermal sensor and control logic
— Thermal management interrupt for software regulation of junction temperature
Testability
— LSSD scan design
— IEEE 1149.1 JTAG interface
1.3 General Parameters
The following list provides a summary of the general parameters of the MPC755:
Technology
0.22 m CMOS, six-layer metal
Die size
6.61 mm x 7.73 mm (51 mm2)
Transistor count
6.75 million
Logic design
Fully static
Packages
MPC745:
Surface mount 255 plastic ball grid array (PBGA)
MPC755:
Surface mount 360 ceramic ball grid array (CBGA)
Surface mount 360 plastic ball grid array (PBGA)
Core power supply
2.0 V ± 100 mV DC (nominal; some parts support core voltages down to
1.8 V; see Table 3 for recommended operating conditions)
I/O power supply
2.5 V ± 100 mV DC or
3.3 V ± 165 mV DC (input thresholds are configuration pin selectable)
相關(guān)PDF資料
PDF描述
MPC755BRX450LE 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
MPC755CPX400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC745BVT350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BVT300LE 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
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