參數(shù)資料
型號(hào)： MPC745BVT350LE
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
封裝： 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-255
文件頁(yè)數(shù)： 42/60頁(yè)
文件大?。?/td> 1559K
代理商： MPC745BVT350LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
Freescale Semiconductor
47
System Design Information
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 27 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 25). This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers
the best thermal performance, considering the low interface pressure. Of course, the selection of any
thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 27 describes the thermal performance of select thermal interface materials.
External Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
(Note the internal versus external package resistance.)
Internal Resistance
Die/Package
Package/Leads
Die Junction
相關(guān)PDF資料
PDF描述
MPC745BPX350LE 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
MPC755BPX350LE 32-BIT, 350 MHz, RISC PROCESSOR, PBGA360
MPC755CPX400LE 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300LE 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC755BVT300LE 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC745CPX350LE 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745CPX350LE 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA
MPC745CVT350LE 功能描述:微處理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC75 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors
MPC750 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC750 RISC Microprocessor
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