參數(shù)資料
型號(hào)： MPC7410RX450LD
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 2/52頁(yè)
文件大?。?/td> 943K
代理商： MPC7410RX450LD
10
MPC7410 RISC Microprocessor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
Table 3 provides the recommended operating conditions for the MPC7410.
Table 4 provides the package thermal characteristics for the MPC7410.
Table 3. Recommended Operating Conditions 1
Characteristic
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.8 V ± 100 mV
V
PLL supply voltage
AVDD
1.8 V ± 100 mV
V
L2 DLL supply voltage
L2AVDD
1.8 V ± 100 mV
V
Processor bus supply
voltage
BVSEL = 0
OVDD
1.8 V ± 100 mV
V
BVSEL = HRESET
OVDD
2.5 V ± 100 mV
V
BVSEL = HRESET or
BVSEL = 1
OVDD
3.3 V ± 165 mV
V
2, 3
L2 bus supply voltage
L2VSEL = 0
L2OVDD
1.8 V ± 100 mV
V
L2VSEL = HRESET or
L2VSEL = 1
L2OVDD
2.5 V ± 100 mV
V
Input voltage
Processor bus and
JTAG signals
Vin
GND to OVDD
V
L2 bus
Vin
GND to L2OVDD
V
Die-junction temperature
Tj
0 to 105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions
is not guaranteed.
2. MPC7410RXnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a
recommended OVDD value of 2.5 V ± 100 mV for BVSEL = 1.
3. MPC7410RXnnnLE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = HRESET.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
CBGA
Junction-to-ambient thermal resistance, natural convection,
single-layer (1s) board
RθJA
24
30
°C/W
1, 2
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
RθJMA
17
22
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min airflow,
single-layer (1s) board
RθJMA
18
23
°C/W
1, 3
Junction-to-ambient thermal resistance, 400 ft/min airflow,
single-layer (1s) board
RθJMA
16
21
°C/W
Junction-to-ambient thermal resistance, 200 ft/min airflow,
four-layer (2s2p) board
RθJMA
14
19
°C/W
1, 3
相關(guān)PDF資料
PDF描述
MPC7410RX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC7410RX400LD 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC7410RX500LC 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360
MPC7410HX450LE 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
MPC7410RX450LD 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7410RX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
MPC7410RX500LE 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤
MPC7410THX400LE 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410THX400NE 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk
MPC7410THX450NE 功能描述:微處理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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