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參數(shù)資料
| 型號： | MPC740PRX366LE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 366 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大小： | 543K |
| 代理商： | MPC740PRX366LE |
XPC750P RISC Microprocessor Hardware Specications
5
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
Figure 1. shows the permitted undershoot and overshoot voltage on the XPC750P.
Figure 1. Overshoot/Undershoot Voltage
Table 3. provides the recommended operating conditions for the XPC750P.
Table 4. provides the package thermal characteristics for the XPC750P.
Note: Refer to Section 1.8, System Design Information, for more details about thermal management.
Table 3. Recommended Operating Conditions
Characteristic
Symbol
300, 333MHz
366MHz
400MHz
Unit
Core supply voltage
Vdd
1.9 ± 100mv
2.05 ± 50mv
V
PLL supply voltage
AVdd
1.9 ± 100mv
2.05 ± 50mv
V
L2 DLL supply voltage
L2AVdd
1.9 ± 100mv
2.05 ± 50mv
V
60x bus supply voltage
OVdd
3.3 ± 165mv
V
L2 bus supply voltage
L2OVdd
3.3 ± 165mv
V
Input voltage
Vin
GND to OVdd
V
Die-junction temperature
Tj
0 to 105
0 to 65
C
Note: These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
qJC
0.03
C/W
CBGA package thermal resistance, die junction-to-lead thermal resistance (typical)
qJB
3.8
C/W
VIH
Gnd
Gnd - .3V
Gnd - 1.0V
Not to exceed 10%
4V
VIL
(L2)OVdd
(L2)OVdd + 5%
of tSYSCLK
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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